• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method of collective manufacturing of electronic devices, comprising the steps of: mounting electronic chips (4) on one side of a collective substrate plate, extending and securing a collective flexible sheet of a heat conductive material comprising a base layer of graphite on a collective area extending above the chips and above the collective substrate plate, between the chips, compressing said collective flexible sheet, making a cut for obtaining electronic devices comprising a chip, a portion of said collective plate and a portion of said collective flexible sheet. An electronic device comprising a substrate plate (2), an electronic chip (4) mounted on the substrate plate, and a graphite-based heat conducting flexible layer (12), the flexible layer being located on an area (11). ) extending above the chip and above the plate, around the chip.
    公开号:FR3053526A1
    申请号:FR1656331
    申请日:2016-07-01
    公开日:2018-01-05
    发明作者:Didier Campos；Benoit Besancon；Perceval Coudrain；Jean-Philippe Colonna
    申请人:Commissariat a lEnergie Atomique CEA；STMicroelectronics SA；STMicroelectronics Grenoble 2 SAS；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    Holder (s): COMMISSIONER OF ATOMIC ENERGY AND ALTERNATIVE ENERGIES Public establishment, STMICROELECTRONICS (GRENOBLE 2) SAS, STMICROELECTRONICS SA Limited company.
    Extension request (s)
    Agent (s): CASALONGA & ASSOCIES.
    METHOD FOR THE COLLECTIVE MANUFACTURE OF ELECTRONIC DEVICES AND ELECTRONIC DEVICE.
    FR 3 053 526 - A1 f5 // Method for the collective manufacture of electronic devices, comprising the following steps: mounting electronic chips (4) on one face of a collective plate of substrate, spreading and fixing a flexible flexible sheet made of a material heat conductive comprising a graphite-based layer on a collective area extending above the chips and above the collective substrate plate, between the chips, compressing said collective flexible sheet, making a cutout for the obtaining electronic devices comprising a chip, a portion of said collective plate and a portion of said collective flexible sheet.
    Electronic device comprising a substrate plate (2), an electronic chip (4) mounted on the substrate plate, and a flexible heat-conductive layer (12) based on graphite, the flexible layer being located on an area (11 ) extending above the chip and above the plate, around the chip.

    i
    Collective manufacturing method of electronic devices and electronic device
    The present invention relates to the field of electronic devices including electronic chips of integrated circuits.
    Some electronic chips produce heat during operation, which must be removed. In some cases, this heat production is local and causes a local and undesirable rise in temperature.
    Currently, it is known to equip electronic devices with metal plates, generally made of copper, and possibly to add radiators.
    However, such metal plates do not make it possible to avoid an excessive local rise in the temperature of the electronic chips since the diffusion of heat occurs essentially in the thickness direction of the metal plates. In addition, during manufacture, the metal plates are placed individually on the electronic chips.
    The object of the present invention is to improve the evacuation of the heat produced in particular locally by electronic chips and to allow collective production of electronic devices.
    According to one embodiment, a method of collective manufacturing of electronic devices is proposed.
    The process includes the following steps:
    a) mounting a plurality of electronic chips on a mounting face of a collective substrate plate, at a distance from each other and at locations,
    b) spreading a collective flexible sheet comprising at least one layer of a heat conductive material, based on graphite, on a collective zone extending above the electronic chips and above the mounting face of the plate collective of substrate, between the electronic chips,
    c) compressing said collective flexible sheet in the direction of said collective zone, and
    d) make a cutout for obtaining electronic devices respectively comprising at least one of the electronic chips, a portion of said collective substrate plate corresponding to a location and a portion of said collective flexible sheet corresponding to this location.
    The graphite of said flexible sheet can be pyrolytic (PGS).
    The method can include the following step between step a) and step b): making a collective encapsulation block at least partially filling the spaces between the electronic chips, said collective area comprising at least part of the faces rear of the electronic chips and a rear face of said collective encapsulation block.
    The method may include the following step between step a) and step b) making encapsulation rings extending respectively around the electronic chips and above the mounting face of the substrate plate, said collective area comprising at least part of the rear faces of the electronic chips, at least part of the rear faces of said encapsulation rings and at least part of the mounting face of the collective substrate plate extending between said rings encapsulation.
    The process can include the following step after step b) or step c): making a collective encapsulation block above said flexible sheet.
    The method may include the following step after step b) or step c): making a collective protective layer on said collective flexible sheet.
    The method may include the following step between steps a) and b): making a collective layer of protection above said zone.
    The method may include the following step between steps a) and b): making a collective layer of protection above said zone.
    Said collective flexible sheet to be spread can comprise the graphite-based layer and a protective layer.
    Said collective flexible sheet to be spread may include the graphite-based layer interposed between two protective layers.
    The protective layer or layers may have a hardness greater than the hardness of said graphite-based layer.
    The method can include the following step: fixing said collective flexible sheet above said collective area by means of a collective layer of glue.
    An electronic device is also proposed which includes:
    a substrate plate having a mounting face, at least one electronic chip, a front face of which is mounted on said mounting face of the substrate plate, and a flexible layer comprising at least one layer of a heat-conducting material, graphite base, the flexible layer being located on an area extending above a rear face of the electronic chip and above said mounting face of said substrate plate, around the electronic chip.
    Said flexible layer may comprise a layer of pyrolytic graphite (PGS).
    A layer of adhesive can be interposed between said flexible layer and said zone.
    A protective layer may be provided above said graphite-based layer.
    A protective layer may be provided below said graphite-based layer.
    The protective layer or layers may have a hardness greater than the hardness of said graphite-based layer.
    The device may include an encapsulation block around said electronic chip and between the mounting face of said substrate plate and said flexible layer, said zone comprising the rear face of the electronic chip and a rear face of said encapsulation block.
    The device may include an encapsulation ring extending around the electronic chip and on the mounting face of the substrate plate, said zone comprising the rear face of the electronic chip, a rear face of said encapsulation ring and a part of the mounting face of the substrate plate surrounding said encapsulation ring.
    The device may include an encapsulation block above said flexible layer.
    Electronic devices and methods of manufacturing these will now be described by way of example embodiments, illustrated by the drawing in which:
    - Figure 1 shows a section through an electronic device;
    - Figures 2 to 4 show sections illustrating a method of manufacturing the electronic device of Figure 1;
    - Figure 5 shows a section through another electronic device; and
    FIGS. 6 to 8 represent sections illustrating a method of manufacturing the electronic device of FIG. 5.
    As illustrated in FIG. 1, an electronic device 1 comprises a support plate 2 made of an insulating substrate, including a network of electrical connections 3.
    The electronic device 1 comprises an integrated circuit electronic chip 4 mounted on the support plate 2 via a plurality of electrical connection elements 5 such as balls or metal pillars, interposed between a mounting face 6 of the support plate 2 and a front face 7 of the electronic chip 4. The electrical connection elements 5 are connected on the one hand to the network of electrical connections 3 of the support plate 2 and on the other hand to the integrated circuits of the electronic chip
    4.
    The electronic device 1 also comprises an intermediate encapsulation block 8, for example made of an epoxy resin, extending on the mounting face 6 of the support plate 2 and surrounding the electronic chip 4 up to the peripheral edge of the plate support 2.
    According to an alternative embodiment, the encapsulation block 8 has a rear face 9 which extends in the plane of a rear face 10 of the electronic chip 4 opposite the front face 7, to form a rear zone 11 parallel to the mounting face 6 of the substrate plate 2.
    According to another alternative embodiment, the encapsulation block 8 can cover the rear face 10 of the electronic chip 4, so that the rear zone 11 is formed only by the rear face of the encapsulation block 8.
    The electronic device 1 comprises a rear layer 12 of a flexible material in the form of a sheet, which conducts heat, which extends over the zone 11 and which is fixed to the latter by means of a thin layer of heat conductive glue 13. For example, the adhesive layer 13 can be based on silicone or polyimide or epoxy and its thickness can be between one and thirty microns. The heat conducting layer 12 extends to the peripheral edge of the encapsulation block 8. In an alternative embodiment, the flexible conducting layer 12 could be fixed by compression, without a layer of adhesive, possibly with the interposition of a thin metallic sheet, for example copper.
    The flexible heat conducting layer 12 is based on graphite. Advantageously, this layer 12 comprises a pyrolytic graphite (PGS). Its thickness can be between five microns and one millimeter.
    The electronic device 1 also comprises a rear outer protective layer 14 which covers a face 15 of the heat conducting layer 12, facing outwards. The face 15 of the layer 12 is opposite to the face of the layer 12 in contact with the adhesive. This outer layer 14 has a hardness greater than the hardness of the heat conducting layer 12, made of pyrolytic graphite, and thus makes it possible to protect this layer 12 against pressure and shock. The outer protective layer is for example based on polyimide adhering to the flexible sheet and its thickness can be between five and thirty microns. The electronic device 1 is in the form of a parallelepiped, with a square or rectangular base.
    The electronic device 1 also comprises external electrical connection elements 16 placed on the external face 17 of the support plate 2 opposite its mounting face 6. The elements 16 are connected to the network of electrical connections 3.
    Thanks to the heat conducting layer 12 made of pyrolytic graphite, the heat produced by the electronic chip 4, generally locally, diffuses into this layer 12 parallel to the zone 11 in all directions, that is to say perpendicular to the thickness of this layer 12, so that the face 15 facing outward of the heat conducting layer 12 diffuses the heat outward almost uniformly over its entire surface. Thus, an excessive rise, locally, of the temperature of the electronic chip 4 can be avoided because the evacuation of the heat produced is improved.
    The electronic device 1 comes from a collective manufacture which will now be described.
    As illustrated in FIG. 2, there is a substrate plate 2A including a plurality of networks of electrical connections 3, provided respectively in adjacent locations E, for example with square or rectangular contours, arranged in a matrix, each location E corresponding to an electronic device 1 to be produced.
    An electronic chip 4 has been mounted on a mounting face 6A of the substrate plate 2A, in each of the locations E, by means of electrical connection elements 5, these chips being at a distance from each other.
    A collective encapsulation block 8A, for example made of epoxy resin, was formed on the mounting face 6A of the substrate plate 2A and in the spaces separating the electronic chips 4. Beforehand, an encapsulation material, also made of an epoxy resin, can be injected between each of the electronic chips 4 and the substrate plate 2A.
    According to an alternative embodiment, the collective encapsulation block 8A surrounds the electronic chips 4 and has a rear face 9A which extends in the plane of the rear faces 10 of the electronic chips 4, to form a flat rear collective zone 11A parallel to the mounting face 6A of the substrate plate 2A.
    According to another alternative embodiment, the collective encapsulation block 8A can also cover the rear faces 10 of the electronic chips 4, so that the collective rear zone 11A is formed only by the rear face 9A of the encapsulation block 8A.
    As illustrated in FIG. 3, a thin collective layer of glue 13A has been spread over the rear collective zone 11 A. The collective layer of glue 13A can be based on silicone or polyimide or epoxy and its thickness can be understood between five and thirty microns.
    Then, a flexible collective sheet 12A, made of pyrolytic graphite, was spread over the collective layer of glue 13A. The thickness of this collective flexible sheet 12A can be between five and two hundred microns.
    Then, heating was carried out and the collective sheet 12A was pressed in the direction of the rear collective zone 11A, using a tool P such as a press plate or a roller, in order to ensure bonding and so that the collective flexible sheet 12A matches the topography of the rear collective zone 11 A.
    As illustrated in FIG. 4, a collective protective layer 14A has been deposited on the bonded collective sheet 12A. The collective protective layer 14A can be based on polyimide adhering to the flexible sheet 12A and its thickness can be between five and thirty microns.
    Then, electrical connection elements 16 are placed on the face 17A of the substrate plate 2A, opposite its mounting face 6A, the electrical connection elements 16 being respectively connected to the electrical connection networks 3.
    Next, a cut is made, perpendicular to the collective substrate plate 2A and along the rows and columns of the location matrix E, through the collective substrate plate 2A, from the collective encapsulation block 8A, of the collective layer of glue 13A, of the collective sheet 12A and of the collective protective layer 14A, the material of the flexible sheet 12A not constituting an obstacle for this cutting.
    A plurality of electronic devices 1 is thus obtained, each one being of parallelepiped shape and comprising an electronic chip 4, a portion of the collective substrate plate 2A, a portion of the collective encapsulation block 8A, a portion of the conductive layer of the heat 14A, a portion of the collective layer of glue 13A and a portion of the collective protective layer 14A, corresponding to the locations E.
    According to an alternative embodiment, prior to its spreading, the collective flexible sheet 12A can be provided on one face with the rear protective layer 14A, so as to form a collective multilayer sheet to be spread over the rear collective area 11A .
    According to another alternative embodiment, prior to its spreading, the collective flexible sheet 12A can be interposed between the rear protective layer 14A on one side and a protective layer on its other side, so as to form a collective flexible multi-layer sheet with spread over the rear collective area 11A.
    As illustrated in FIG. 5, an electronic device 101 comprises a support plate 102 made of an insulating substrate, including a network of electrical connections 103.
    The electronic device 101 includes an integrated circuit electronic chip 104 mounted on the support plate 102 by means of a plurality of electrical connection elements 105 such as balls or metal pillars, interposed between a mounting face 106 of the support plate 102 and a front face 107 of the electronic chip 104. The electrical connection elements 105 are connected on the one hand to the network of electrical connections 103 of the support plate 102 and on the other hand to the integrated circuits of the electronic chip 104.
    The electronic device 101 comprises an encapsulation material 108 on the mounting face 106 of the support plate 102, which fills the space between the support plate 102 and the electronic chip 104 and which forms an encapsulation ring 109 which fills the corner between the support plate 102 and the periphery of the electronic chip 104. The encapsulation ring 109 does not reach the periphery of the support plate 102 and constitutes an intermediate encapsulation block.
    Thus, a rear zone 110 is defined which comprises the rear face 111 of the chip 104, the peripheral portion 112 of the mounting face 106 of the support plate 102 (which surrounds the encapsulation ring 109) and the rear face 113 of this encapsulation ring 109.
    The electronic device 101 comprises a rear layer 114 of a flexible, heat-conducting material, which extends over the area 110 and which is fixed on the latter by means of a thin layer of glue 115 which conducts the heat. . The heat conducting layer 114 extends to the peripheral edge of the support plate 102 and is in the form of a bowl or cavity inside which the electronic chip 104 and the encapsulation ring 109 are located. In other words, part of the layer 114 more or less substantially matches the shape of the chip 104. The heat conducting layer 114 is based on graphite, advantageously a pyrolytic graphite (PGS).
    The electronic device 101 includes an optional protective layer 116 which at least partially covers the rear layer 114.
    The electronic device 101 further comprises an outer rear encapsulation block 117 which covers at least the peripheral portion of the protective layer 116 and which extends to the peripheral edge of the heat conducting layer 114, so ίο that the encapsulation block 117 has an outer rear face 118 parallel to the support plate 102. The electronic device 101 is in the form of a parallelepiped, with a square or rectangular base.
    The protective layer 116 and / or the encapsulation block 117 have a hardness greater than the hardness of the heat conducting layer 114, made of pyrolytic graphite, and thus make it possible to protect this layer 114 against pressures and shocks.
    The electronic device 101 further comprises external electrical connection elements 119 placed on the external face 120 of the support plate 102 opposite its mounting face 106, these elements 119 being connected to the network of electrical connections 103.
    As in the case of the previous example, thanks to the heat conducting layer 114 made of a pyrolytic graphite, the heat produced by the electronic chip 104, generally locally, diffuses into this layer 114 parallel to the zone 110 in all directions. , that is to say perpendicular to the thickness of this layer 114, so that the face turned towards the outside of the heat conducting layer 114 diffuses the heat towards the outside in an almost homogeneous manner over its whole surface, through the encapsulation block 117. Thus, an excessive rise, locally, of the temperature of the electronic chip 104 can be avoided because the evacuation of the heat produced is improved.
    The electronic device 101 comes from a collective manufacturing which will now be described.
    As illustrated in FIG. 6, there is a substrate plate 102A including a plurality of networks of electrical connections 103, provided respectively in adjacent locations E, for example with square or rectangular contours, arranged in a matrix. Each location E corresponds to an electronic device 101 to be produced.
    An electronic chip was mounted on a mounting face 106A of the substrate plate 102A, in each of the locations E
    104, at a distance from each other, by means of electrical connection elements 105.
    Encapsulation material 108 was introduced into the spaces between each of the chips 104 and the mounting face 106A of the substrate plate 102. Encapsulation rings 109 were formed at the same time around the electronic chips 104 on the mounting face 106A of the substrate plate 102A.
    A non-flat rear collective area 110A is then formed which includes the rear faces 111 of the electronic chips 104, the rear faces 113 of the encapsulation rings 109 and the collective portions 121 of the mounting face 106A of the substrate plate 102A which s 'extend between the encapsulation rings 109, above the spaces between the chips 104.
    As illustrated in FIG. 7, a thin collective layer of glue 115A has been spread over the rear collective zone 110A.
    Then, a flexible collective sheet 114A, made of pyrolytic graphite, was spread over the adhesive layer 115A.
    Then, heating was carried out and the sheet 114A was pressed in the direction of the rear collective area 110A, using a tool P so that the flexible collective sheet 114A follows the topography of the collective area 110A. This tool P advantageously has, in the form of an embossing, recessed faces 122 situated opposite the rear faces 111 of the chips 104 and projecting faces 123 situated opposite the collective portions 121 of the substrate plate 102A.
    As illustrated in FIG. 8, a collective protective layer 116A has been formed on the glued collective flexible sheet 114A.
    Then, on the collective protective layer 116A, a collective encapsulation block 117A was formed, for example in an epoxy resin.
    Then, electrical connection elements 119 were placed on the face 120A of the substrate plate 102A, opposite its mounting face 106A, the electrical connection elements 119 being respectively connected to the electrical connection networks 3.
    Next, a cut is made, perpendicular to the collective substrate plate 102A and along the rows and columns of the location matrix E, through the collective substrate plate 102A, of the collective layer of glue 115A, the collective sheet 114A, the collective protective layer 116A and the collective encapsulation block 117A.
    A plurality of electronic devices 101 are thus obtained, each being of parallelepiped shape and comprising an electronic chip 104, an encapsulation ring 109, a portion of the collective substrate plate 102A, a portion of the heat conducting layer 114A, a portion of the collective adhesive layer 111A, a portion of the protective layer 116A and a portion of the collective encapsulation block 117A, corresponding to the locations E.
    Equivalently to the previous example and according to an alternative embodiment, prior to its spreading, the collective flexible sheet 114A can be provided on one side with the rear protective layer 116A and optionally with a protective layer on its other side. , so as to form a multi-layer collective sheet to be spread over the rear collective area 110A.
    权利要求:
    Claims (20)
    [1" id="c-fr-0001]
    1. Method for the collective manufacture of electronic devices (1, 101), comprising the following steps:
    a) mounting a plurality of electronic chips (4; 104) on a mounting face (6A) of a collective substrate plate (2A; 102A), at a distance from each other and at locations,
    b) spreading a collective flexible sheet comprising at least one layer (12A; 114A) of a heat conductive material, based on graphite, on a collective zone (11A; 110A) extending above the electronic chips and above the mounting face of the collective substrate plate, between the electronic chips,
    c) compressing said collective flexible sheet in the direction of said collective zone, and
    d) make a cutout for obtaining electronic devices respectively comprising at least one of the electronic chips, a portion of said collective substrate plate corresponding to a location and a portion of said collective flexible sheet corresponding to this location.
    [2" id="c-fr-0002]
    2. Method according to claim 1, in which the graphite is pyrolytic (PGS).
    [3" id="c-fr-0003]
    3. Method according to one of claims 1 and 2, comprising the following step between step a) and step b): making a collective encapsulation block (8A) at least partially filling the spaces between the electronic chips, said collective zone comprising at least part of the rear faces of the electronic chips and a rear face of said collective encapsulation block.
    [4" id="c-fr-0004]
    4. Method according to one of claims 1 and 2, comprising the following step between step a) and step b): making encapsulation rings (109) extending respectively around the electronic chips and at above the mounting face of the substrate plate, said collective zone comprising at least part of the rear faces of the electronic chips, at least part of the rear faces of said encapsulation rings and at least part of the mounting face of the collective substrate plate extending between said encapsulation rings.
    [5" id="c-fr-0005]
    5. Method according to one of the preceding claims, comprising the following step after step b) or step c): produce a collective encapsulation block (117A) above said flexible sheet.
    [6" id="c-fr-0006]
    6. Method according to any one of the preceding claims, comprising the following step after step b) or step c): producing a collective protective layer above said collective flexible sheet.
    [7" id="c-fr-0007]
    7. Method according to any one of the preceding claims, comprising the following step between steps a) and b): making a collective layer of protection over said zone.
    [8" id="c-fr-0008]
    8. Method according to any one of claims 1 to 5, wherein said collective flexible sheet to spread comprises the graphite-based layer and a protective layer.
    [9" id="c-fr-0009]
    9. Method according to any one of claims 1 to 5, wherein said collective flexible sheet to spread comprises the graphite-based layer interposed between two protective layers.
    [10" id="c-fr-0010]
    10. Method according to any one of claims 6 to 9, in which the protective layer or layers have a hardness greater than the hardness of said graphite-based layer.
    [11" id="c-fr-0011]
    11. Method according to any one of the preceding claims, comprising the following step: fixing said collective flexible sheet above said collective zone by means of a collective layer of glue (13A; 115A).
    [12" id="c-fr-0012]
    12. Electronic device comprising:
    a substrate plate (2; 102) having a mounting face, at least one electronic chip (4; 104), a front face of which is mounted on said mounting face of the substrate plate, and a flexible layer (12; 114 ) comprising at least one layer of graphite-based heat conductive material, the flexible layer being situated on an area (11; 110) extending above a rear face of the electronic chip and above of said mounting face of said substrate plate, around the electronic chip.
    [13" id="c-fr-0013]
    13. Device according to claim 12, in which said flexible layer comprises a pyrolytic graphite (PGS).
    [14" id="c-fr-0014]
    14. Device according to one of claims 12 and 13, comprising a layer of adhesive (13; 115) between said flexible layer and said zone.
    [15" id="c-fr-0015]
    15. Device according to any one of claims 12 to
    14, comprising a protective layer (14; 116) above said graphite-based layer.
    [16" id="c-fr-0016]
    16. Device according to any one of claims 12 to
    15, comprising a protective layer below said graphite-based layer.
    [17" id="c-fr-0017]
    17. Device according to one of claims 15 and 16, wherein said protective layer has a hardness greater than the hardness of said graphite-based layer.
    [18" id="c-fr-0018]
    18. Device according to any one of claims 12 to 17, comprising an encapsulation block (8) around said electronic chip and between the mounting face of said substrate plate and said flexible layer, said zone (11) comprising the rear face of the electronic chip (10) and a rear face (9) of said encapsulation block.
    [19" id="c-fr-0019]
    19. Device according to any one of claims 12 to 17, comprising an encapsulation ring (109) extending around the electronic chip and on the mounting face of the substrate plate, said zone (110) comprising the rear face (111) of the electronic chip, a rear face (113) of said encapsulation ring and a part (112) of the mounting face of the substrate plate surrounding said encapsulation ring.
    [20" id="c-fr-0020]
    20. Device according to any one of claims 12 to 19, comprising an encapsulation block (117) above said flexible layer.
    1/4
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    US9960099B2|2013-11-11|2018-05-01|Taiwan Semiconductor Manufacturing Co., Ltd.|Thermally conductive molding compound structure for heat dissipation in semiconductor packages|
    JP6254509B2|2014-11-07|2017-12-27|信越化学工業株式会社|Sealing material with electromagnetic shielding support base material, post-sealing semiconductor element mounting substrate, post-sealing semiconductor element forming wafer, and semiconductor device|FR3061630B1|2017-01-03|2021-07-09|St Microelectronics Grenoble 2|METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER|
    FR3061628A1|2017-01-03|2018-07-06|StmicroelectronicsSas|METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    FR3061629A1|2017-01-03|2018-07-06|StmicroelectronicsSas|METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    法律状态:
    2017-06-20| PLFP| Fee payment|Year of fee payment: 2 |
    2018-01-05| PLSC| Publication of the preliminary search report|Effective date: 20180105 |
    2018-06-21| PLFP| Fee payment|Year of fee payment: 3 |
    2019-06-21| PLFP| Fee payment|Year of fee payment: 4 |
    2020-06-23| PLFP| Fee payment|Year of fee payment: 5 |
    2021-06-23| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1656331|2016-07-01|
    FR1656331A|FR3053526B1|2016-07-01|2016-07-01|METHOD FOR COLLECTIVELY MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICE|FR1656331A| FR3053526B1|2016-07-01|2016-07-01|METHOD FOR COLLECTIVELY MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICE|
    US15/632,878| US9870947B1|2016-07-01|2017-06-26|Method for collectivefabrication of electronic devices and electronic device|
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